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ATC Flagship Series Sputtering Systems


ATC FLAGSHIP SERIES SPUTTERING SYSTEMS

General Information

AJA International ATC Flagship Series Sputtering Systems are versatile PVD coating tools which can be built in a variety of configurations to satisfy most requirements. These systems are built around AJA's unique A300-XP (UHV) or Stiletto Series (HV) magnetron sputtering sources which feature in-situ source head tilting allowing precise and repeatable con-focal, direct, and off-axis thin film deposition. All systems include a heavy duty hoist to lift the chamber top for system access.

Systems are available in the following chambers sizes:
  • ATC 1800  (18"  Ø)
  • ATC 2200 (22" Ø)
  • ATC 2600 (26" Ø)
ATC Cassette and Load Lock
Substrate holders with heating or cooling from 25mm to 300mm Ø are available on these machines. AJA magnetron sputter sources from 1"-12" Ø, plus rectangular, triangular and turret sputter sources can be incorporated. The maximum number of sputter sources will depend on the substrate size, configuration and magnetron sputter source size. For example, the ATC 1800 can be fitted with (5) 2" magnetrons with in-situ tilt. Consult the factory for optimum configuration.  These versatile sputtering systems can be also fitted with other deposition sources 
(e-beam evaporation, thermal evaporation and PLD) , ion sources, facing target sputtering sources (FTS), contact masking systems, metal-sealed tops, bake jackets, glove boxes, cassettes, auto-loading and analytical tools (RHEED, XPS, Auger, RGA, Ellipsometers and MOS).

Labview based computer control and either turbomolecular or cryopumping are utilized depending on the application. ATC Flagship Systems can also be easily connected to each other or to ATC Orion Systems for multi-chamber (e.g. metal/oxide) or multi-technique (e.g. sputter/e-beam evaporation/thermal evaporation/PLD/ion milling/analytical) configurations.

TYPICAL flagship Sputtering system configurations

ATC 1800 UHV - Standard Con-Focal

ATC 1800 Sputtering System
ATC 1800 UHV
(5) con-focal A320-XP 2" UHV sputter sources with in-situ tilt, (1) normal incidence A330-XP-3” UHV sputtering source for high rate applications, CTI-8 cryopump, 850°C rotating substrate heater with RF bias, computer control & load-lock for 100 mm Ø substrates.

ATC 2200 UHV - 9 Position Cassette Auto-Loading

ATC 2200 Sputtering System
ATC 2200 UHV
(6) A330-XP 3" UHV sputter sources with in-situ tilt, 1200 l/s turbopump, 800°C, rotating substrate heater with RF bias, computer control and automated (9) substrate cassette elevator in the load-lock for 150 mm Ø substrates.

ATC 2200 UHV - Combinatorial Chemistry Configuration

ATC 2200 Sputtering System 1
ATC 2200 UHV
(6) A330-XP (3" target) in-situ tilt, sputter sources are employed to deposit a circular array of discrete, combinatorial dots onto wafers or 156 mm square glass substrates. The same system can also be used to deposit continuous gradients from up to six directions simultaneously.
SiO2 film
Combinatorial Dots
Refraction of SiO2 film showing gradient deposition
Circular Array of Discrete Combinatorial Dots on wafer and glass square substrates

ATC 2200 UHV - 10 to 13 Source GMR/MTJ Research System

ATC 2200 Sputter System 2
ATC 2200 UHV 
(11) Source GMR/MTJ research system with auto-loading and 6 position cassette.
11 Source GMR/MTJ
13 Source GMR/MTJ
11 Source GMR/MTJ Research System
(8) A320-XP 2" sources and (3) A315-XP 1.5" sources for GMR/MTJ research
13 Source GMR/MTJ Research System
(2) A320-XP 2" sources for MM targets and up to (11) A315-XP 1.5" sources for GMR/MTJ films

ATC 2200 HV - Direct Sputter High Rate Turret Coater

ATC 2200 Sputter System 3
ATC 2200 HV 
High rate direct sputter Turret Coater for 4" wafers.  Wafers can be flipped in-situ and coated on both sides.  Turret incorporates (4) STX-150 (6") magnetron sources and a 1000 W RF power supply/matchbox with integral, automatic, (4) way switchbox.
Axial Turret
Axial Turret  with shield
STX-150-4 Axial Turret 
compatible with 1000 W RF
STX-150-4T Axial Turret 
with gas ring and removable shield

ATC 2600 UHV - Direct Sputter 12 Source Coating Tool

ATC 2600 Sputter System
ATC 2600 UHV
(12) Source direct sputter coater for (8) 1" samples.  Sample positioning is stepper motor controlled and programmable.

TYPICAL RATE / UNIFORMITY DATA

The ATC Series Thin Film Deposition Systems can be configured for con-focal, direct, and off-axis deposition. Con-focal deposition with in-situ tilt sputter sources (AJA pioneered and developed this concept in 1991) can deliver uniformity of better than +/- 2% on substrates twice the diameter of the targets. Often +/- 1% or better is achievable. A typical deposition profile with SiO(2) on a 6" diameter Si wafer is shown.

Deposition rate is a function of sputter yield of the material, maximum allowable power density into the target (depends on heat transfer capability of target material), and type of power used (e.g. RF, DC, pulsed DC).

Maximum deposition rates are achieved with materials such as Au - high sputter yield, excellent heat transfer material and can be sputtered with DC (most efficient). Slow deposition rates can be expected with materials such as Al2O3 - very low sputter yield, poor heat transfer material and must be sputtered with RF (1/2 the efficiency of DC). Typical rates are 0-18 Å/sec with Au, 0-9 Å/sec with Cu and 0-0.16 Å/sec with Al2O3 in a confocal configuration with 2" sources on a 100 mm diameter substrate. Off-axis deposition rates are typically 1-5 times lower than con-focal deposition rates depending on substrate size and system configuration.

Direct deposition at short working distances (50-100 mm) can achieve rates as high as 300 Å/sec but con-focal geometry results in much better uniformity, the ability to co-deposit alloy films and the ability to grow better ultra-thin film multilayers since the substrate is always "in the plasma." The cost of the smaller targets employed in con-focal configurations can also significantly reduce operating cost. The ultimate system configuration offered will always depend on the application.
 A330-XP Sputter Source
ATC Deposition Rate
 A330-XP UHV Magnetron Sputter Source 
 In-situ tilt in con-focal orientation for uniform 
 deposition onto 150 mm Ø substrate.
SiO2 film thickness measurements over 
a 150 mm diameter Si wafer coated in a 
standard  ATC 2200. This particular ATC 
2200 was configured with (6) 3" A330-XP 
UHV magnetron sputter sources featuring
in-situ tilt. This film was deposited by a 
single 3" source in a single run and achieves 
+/- 1.17% uniformity over 140mm diameter.

SPUTTERING SOURCES

A320-XP Sputter Sources
 (6) A320-XP UHV Magnetron Sputter Sources 
 In-situ tilt in a con-focal orientation for uniform  deposition onto 100 mm Ø.
AJA's exclusive Stiletto (HV) and A300 (UHV) Series Magnetron Sputtering Sources are designed for maximum application flexibility. These unique sources feature a modular magnet array which can be configured by the customer to operate in the balanced, unbalanced (Type II) and magnetic material modes. Gas injection chimneys and shutter systems are incorporated to facilitate in-situ tilting and prevent cross-contamination and target poisoning. 3" and 4" sources can be operated at pressures below 4 x 10-4Torr in combination with an ion source to perform IBAD at half the price and complexity of an ion beam assisted ion beam sputtering system.
The Unique AJA Modular Magnet Array & In-situ Tilting Features
The A300XP series and Stiletto Series feature a unique “modular magnet array” which is completely isolated from the cooling water to eliminate magnet deterioration and subsequent degradation of source performance. This design permits access to the internal magnet arrangement thus allowing the same source to be:
  • Adjusted for highly uniform or intentionally non-uniform depositions
  • Operated as a balanced magnetron
  • Configured for maximum target utilization
  • Configured for high or low rate sputtering 
  • Configured for high or low electron energies as they arrive at the substrate surface
  • Operated in a variety of unbalanced magnetron configurations
  • Operated with magnetic material targets and facilitating easy magnet target removal and replacement
Angled Sputter Source
For angled sputtering configurations with rotating substrates, AJA International Inc. sputtering sources can be fitted with the “in-situ tilt” option. This option, shown at the left, allows the source angle to be precisely adjusted from outside the vacuum chamber. Fine tuning the incident angle is critical to achieving good deposition uniformity when working distances, operating pressures and materials are changed. When fixed angle arrangements limit and often compromise the capabilities of a system, “in-situ tilt” can deliver better than +/- 2% uniformity on substrates which can be up to triple the diameter of the source targets.

SUBSTRATE HOLDERS - HEATING / COOLING

The ATC Series Thin Film Deposition Systems are available with either motorized, rotating, substrate holders (for con-focal configurations) or "T" arm substrate holders (for direct deposition). AJA's experienced design and manufacturing team also offers custom substrate holders to satisfy unique requirements. SHQ and SiC Series substrate heaters can achieve temperatures of up to 1000°C and can be fitted with reactive gas  injection rings, substrate RF/DC bias capability for pre-cleaning and ion assisted deposition, in-situ manual or motorized Z motion for working distance adjustment and load-lock transfer, transverse magnetic field with in-situ orientation adjustment between layers and in-situ mask exchange (available with certain configurations). Indexing for "T" arms and for gradient depositions on rotating holders is accomplished with precise stepper motor systems. Electronic triggers for analytical applications are also available. 

AJA manufactures its own PID based temperature controllers and joystick actuated motor controllers for rotation and Z motion. AJA SHQ Series substrate heaters utilize cost effective, durable, fast cycling, quartz halogen lamp technology while the highest temperatures are achieved with Silicon Carbide elements. 


Custom cooled substrate carriers (water/LN2) are also available depending on the requirement.
Substrate Holder
LN2 Reservoir
 8 Position Substrate Holder 
 Custom, stepper motor driven, indexable, for 50
 mm Ø substrates. This component is compatible 
 with load-locks and both manual and automated  loading systems.

1.5 Liter LN2 Reservoir 
Attachments for 100mm Ø transfer plate. This cooled holder features rotation, motorized Z-motion, and a castellated transfer plate to 
eliminate the protrusion of mounting clips.
SiC Substrate Heater
SHQ Quartz Lamp Heater
 SiC Series 1000°C Substrate Heater 
 Rotation, RF/DC bias capability, and motorized 
 Z- motion for 100 mm Ø substrates.
SHQ Series Quartz Lamp Heater
800°C for 150mm Ø substrates featuring motorized Z-motion, rotation and a swing-in QCM for rate calibration.
 T Arm Substrate Holder
SHQ Quartz Lamp Heater 2
 T Arm SHQ/H2O/RFB
 Double ended T arm substrate carrier.  One side 

 has 1000°C heating with RF biasing, the other side  incorporates water cooled heat sinking to cool  down substrates before exposure to air. 
 SHQ Series Quartz Lamp Heater
1000°C for 1.5" Ø substrates featuring transferable substrate carrier and gas injection frame.

PHASE II-J COMPUTER CONTROL

The AJA Labview based Phase II-J Computer Control System is used on all ATC Flagship Series Sputtering Systems. This straightforward, user friendly control system utilizes a large screen laptop in a 19” rack drawer connected to a single 4U rack mount hardware module. The back panel of the hardware module is populated with connectors to interface to all aspects of the sputtering system and to allow for easy future "plug and play" upgrades/expansions.

The Phase II-J control system allows the user to operate in either the “manual mode” or the “automated processing mode”. In the “automated processing mode” the user designs "process layers” which are then compiled and saved as a “process” to be executed with a single command. The system allows up to 104 unique user entry points which are accessible only by password, limiting access to a user’s process layers and thereby preventing unexpected corruption of a user’s saved processes. Data-logging to a Microsoft Excel spreadsheet is standard and is available with an adjustable refresh period. Remote preparation of new processes in a spreadsheet emulator format is available as an option. 

The standard Phase II-J control system will accommodate up to (5) DC power supplies, (4) RF power supplies, (1) 4-way DC switch-box, (1) 4-way RF switch-box, (4) process gases, (16) Valves/shutters, closed loop automatic pressure control, substrate rotation and substrate temperature control. Processes are aborted if plasma is not detected. Special “soak layers” can be easily incorporated into the process.
Labview Computer Control
Phase II J
 Labview Computer Control
 Large screen laptop on convenient slide drawer 

 for Labview based  ATC system computer control.  Replacement laptops are always in stock. 
Computer Control Module Phase IIJ PLC
Compact 4U rack mount case.  This module is fitted from the outset with all receptacles for quick field retrofits/upgrades.

SYSTEM OPTIONS

HV/UHV Sputter Sources
 HV and UHV Magnetron Sputter Sources with 
 In-Situ Tilt
Turbo/Cryo Pumps
 Turbomolecular and Cryogenic Vacuum Pumps

Bake-out Jackets
 Bake-out Jackets


Contact Mask Exchange
 Load-Locks with In-Situ Contact Mask Exchange


Options Labview Computer Control
 Labview based Computer Control on convenient  slide drawer
Sputtering Targets
 Sputtering Targets
Turbo Pumped Load-lock
 Turbo pumped Load-lock with 9 position  Cassette and Auto-loading
Power Supplies
 RF, DC, Pulsed DC and HIPIMS Power Supplies

Tip-In Hazardous Gases
 Easy Access,Tip-In, Utility Boxes for  Pneumatics Cooling/Flow Sensors and for 
 Non- Hazardous Gases
Mini Hazardous Gas Box
 Mini Hazardous Gas Box for H2S  with N2 purge,  gas detector and double walled feed to chamber

Options Power Distribution Modules
 Power Distribution Modules for 208V and 
 380V systems
Options Pressure Control
  Automatic Closed-Loop, Downstream  
  Pressure Control with alternate Position Mode 
  for Upstream Control
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AJA INTERNATIONAL, Inc.
809 Country Way North Scituate, MA 02066
U.S.A.

Tel: +1-781-545-7365      Fax: +1-781-545-4105
email: TOPGUN@AJAINT.COM
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