A300 SERIES UHV MAGNETRON SPUTTERING SOURCES
|
|
|
|
|
| |
GENERAL INFORMATION: A300 Series UHV Sputtering Sources
|
|
|
|
|
 |
The A300-XP UHV sputtering sources are the next generation, "expanded performance" version of the industry standard A300 SERIES magnetron sputtering sources that have dominated the high end, UHV sputter gun market since 1991. New "expanded performance" features include higher pressure operation, improved magnetic material sputtering performance, and a larger product range. Although our competitors have attempted to incorporate certain "AJA innovations" into their product lines during the last 10 years, the new A300-XP source developments will continue to ensure AJA INTERNATIONAL, Inc.'s position well ahead of the pack in the UHV magnetron market.
|
|
|
The A300-XP SERIES sources have been designed to meet the most challenging application requirements in today's thin film deposition markets. Being a manufacturer of custom R&D and small scale production sputtering systems, AJA International, Inc. understands the needs of this market in intimate detail and can help you solve your process, retrofit and system design/configuration issues.
|
|
 |
|
|
|
|
|
|
| |
GENERAL INFORMATION: A310 Series UHV Sputtering Sources
|
|
|
|
|
 |
AJA’s unique A310 series UHV sources have been designed to fit through the port of a 2.75” flange complete with its tilt gimbals assembly. Retrofitting UHV magnetron sputter sources into existing vacuum chambers can be difficult due to the availability and location of appropriate ports. With AJA International’s new A310-XP, one only needs a 2.75” CF (CF38) to accommodate the source head, tilt gimbals and gas injection/isolation chimney. The entire source can be extracted from the chamber without any disassembly. |
|
|
Target changes can be made with one hand either inside or outside of the chamber. This revolutionary new design is true UHV - all ceramic to metal construction. These sources can be combined into multi-gun clusters or be fitted with any sort of custom “goose necked” support tube to point at any spot in the chamber.
The design is ideal for Surface Science chambers and anyone working with small substrates (up to 2” diameter). The A310-XP is suitable for RF and DC operation.
|
|
|
|
|
|
| |
GENERAL INFORMATION: A3CV Series UHV Sputtering Sources
|
|
|
|
|
The AJA International, Inc. A3CV series magnetron sputtering sources feature the unique ability to fit multiple target modules onto a common source head subassembly. This flexibility is ideal for R&D applications where the user wishes to sputter various size targets (large magnetic, small precious metal, standard size and custom size) without incurring the cost of multiple sources. A3CV sources are available in both HV and UHV mounting versions and in either axial or right angle configurations. All sources are RF and DC compatible. Gas Injection Chimneys, source head tilt gimbals, integral shutters and power supplies are optional.
|
|
|
A3CV Series sources also feature the unique AJA International “modular magnet array” allowing the source to be operated as a balance magnetron or in a variety of unbalanced configurations. The magnet array is isolated from the cooling water to eliminate magnet deterioration and subsequent degradation of source performance. In the tradition of other AJA magnetron sources, the A3CV Series delivers premium quality and performance at a reasonable price. Maximum flexibility make the A3CV Series the ideal source for R&D applications
|
|
|
|
|
|
| |
UNIQUE MODULAR MAGNET ARRAY
|
|
|
|
|
The A300-XP SERIES magnetron sputtering sources feature a unique "modular magnet array" which is completely isolated from the cooling water to eliminate magnet deterioration and subsequent degradation of source performance. This design permits access to the internal magnet arrangement thus allowing the same source to be:
|
|
● Operated as a balanced magnetron
● Configured for maximum target utilization
● Configured for high or low rate sputtering
● Operated in a variety of unbalanced magnetron configurations
● Changed for uniform or intentionally non-uniform depositions
● Configured for high or low electron energies as they arrive at the substrate surface
● Operated with thick magnetic material targets, facilitating east magnetic target removal and replacement |
|
|
|
|
|
|
| |
IN-SITU TILT FOR OPTIMUM UNIFORMITY
|
|
|
|
|
|
Deposition uniformity with A320-XP (2" target dia.) with in-situ tilt set at 23°, 110 mm working distance, and focused on a rotating, 4.0" diameter, Si wafer. SiO2 deposition shows +/- 1.2 % uniformity. |
|
|
|
For angled sputtering configurations with rotating substrates, A300-XP sources are typically fitted with the "in-situ tilt" option. This option, shown above, allows the source angle to be precisely adjusted from outside the vacuum chamber. Fine tuning the incident angle is critical to achieving good deposition uniformity when working distances, operating pressures and materials are changed. While fixed angle arrangements limit and often compromise the capabilities of a system, "in-situ tilt" can deliver better than +/- 2% uniformity on substrates which can be up to triple the diameter of the source targets. |
|
|
|
|
|
| |
UHV MAGNETRON SPUTTERING SOURCE CLUSTER FLANGES
|
|
|
|
|
As the world leader in flexible magnetron sputtering source design, AJA International also manufactures many varieties of UHV cluster flanges which integrate anywhere from 2 to 12 A300-XP series magnetron sputtering sources onto a single vacuum flange. With the increasing demand for co-deposited thin films of varying stoichiometries and both magnetic and nonmagnetic multi layers, AJA cluster flanges offer the most extensive range of possibilities currently available on the market. |
|
● UHV in-situ tilt configurations to vary incident angle
● Compact, fixed angle configurations with flip-top shutters
● ISO, CF, wire seal, base plate, top plate and dished head versions available
● Individual source gas rings for reactive sputtering applications
● Integrated source shutter packages with automated controllers
● Individual shielding chimneys to eliminate cross-contamination and reduce operating pressure to less than 0.5mTorr |
|
| |
|
| |
|
|
|
|
|
|
| |
FEATURES / TYPICAL APPLICATIONS
|
|
|
|
FEATURES |
TYPICAL APPLICATIONS
|
● Modular Magnet Array isolated from cooling water
● Magnetic material sputtering of thicker targets
● Easy removal of larger magnetic targets
● Integral gas injection and chimney system
● Efficient target cooling with no vacuum/water seals
● Clamped target mounting for optimal heat transfer
● RF & DC Compatibility
● Rugged UHV Construction
● Operating pressure (0.5 to 1.0 Torr)
● In-situ tilt or manual tilt for optimum uniformity
● Custom versions available
● Source/Power Supply/Target packages available |
● CD / DVD Disk Coatings (e.g. reflective, phase change)
● Semiconductor
● Conductive Metal / Resistive Metal / Insulating Films
● Transparent Electrical Conductors (e.g. ITO)
● Optical Communications Applications (e.g. pump lasers)
● Lens Coatings (reflective / anti-reflective / hard / color)
● Precious Metals (for maximum target utilization)
● Thin Film Sensors
● Coatings for Surgical / Medical Implements & Implants
● Magnetic Storage Media and Heads (HD, GMR , TMR)
● Photovoltaic Thin Films (solar cells)
● Wear Resistant Films
|
|
|
|
|
|
| |
|
| |
|
|
|
RF AUTOMATCHING:
Networks feature one vacuum and one air capacitor for optimum reliability. Air cooling is standard on smaller units. |
300 watt
|
A300RF / A300MU
|
600 watt
|
A600RF / A600MU |
1000 watt
|
A1000RF / A1000MU
|
|
|
LOW POWER RF:
Integrated PS / manual match box makes this package ideal for small sources. |
100 watt
|
A100RF / A100MM
|
300 watt
|
A300RF / A300MM |
|
|
PULSED DC :
These modules / power supplies modulate the DC output to prevent arcing, increase rate or ionize the sputtered material. |
20 kHz
|
ASPL-20
|
Variable
|
ASPL-V |
HIPIMS
|
Sinex 2.0, 4.0, 8.0 |
|
|
DC POWER SUPPLIES:
Supplies feature efficient switching technology, power/current/voltage regulation, arc supression, remote connector and interlocks. |
500 watt
|
A500 DC
|
1000 watt
|
A1000 DC |
1500 watt
|
A1500 DC
|
|
|
DCXS SERIES:
Supplies are fully programmable with process storage & power ramping to reduce thermal stress on the targets. |
750 watt
|
DCXS-750-3 / DCXS-750-5
|
1500 watt
|
DCXS-1500-3 / DCXS-1500-5 |
|
|
|
|
|
|
| |
SPUTTERING TARGETS & EVAPORATION MATERIALS
|
|
|
|
|
 |
|
|
AJA International, Inc. offers a variety of sputtering targets to satisfy virtually any requirement. Targets available in a wide range of materials, sizes and purities. If you don't see the material options you are looking for please don't hesitate to call or email your requirements as custom projects are our specialty. |
|
FABRICATION OPTIONS
|
● MACHINED
● HOT PRESSED
● VACUUM MELT
● STANDARD & CUSTOM BACKING PLATES
● PURITIES FROM 99.0% - 99.999%
● METALIC & EPOXY BONDING
● HIGH TEMP ELASTOMER BONDING |
|
|
TYPES OF MATERIALS AVAILABLE
|
● OXIDES
● BORIDES
● NITRIDES
● SELENIDES
● FLOURIDES |
● SILICIDES
● SULFIDES
● CARBIDES
● ALLOYS
● PURE METALS
● NON-METALS
●
|
|
|
|
FOR A COMPREHENSIVE LIST OF MATERIALS SOLD PLEASE VISIT OUR
TARGETS AND MATERIALS PAGE. |
|
|
|
|
|
| |
|
