STILETTO SERIES MAGNETRON SPUTTERING SOURCES
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The AJA International Stiletto Series magnetron sputtering sources have been designed to meet the most challenging needs of the thin film research community for high vacuum applications while maintaining flexibility and features of the world class A300 Series UHV sources.
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ROUND TARGET SOURCES
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● ST10: 1.0" TARGET Ø
● ST20: 2.0" TARGET Ø
● ST30: 3.0" TARGET Ø
● ST40: 4.0" TARGET Ø |
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RECTANGULAR TARGET SOURCES
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● ST1550: 1.5" X 5.00" TARGET
● ST1580: 1.5" X 8.00" TARGEt
● ST2056: 2.0" X 5.63" TARGEt
● ST2080: 2.0" X 8.00" TARGEt |
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NEW DEVELOPMENTS: UBQD QUICK DISCONNECT
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AJA International, Inc. has developed the perfect quick disconnect for the mounting of HV magnetron sputtering sources with 0.750" support tubes through baseplate holes ranging in size from 1.00" to 34 mm in diameter. Unlike conventional aluminum BQD's (whose threads are easily stripped) or S/S BQD's (which can easily scratch the support tube resulting in leaks), the AJA UBQD uses a stainless body with a PTFE glide ring to protect the support tube and an atmosphere side brass nut to prevent galling of the threads. It also includes an adapter ring to accommodate 32-34 mm baseplate holes and is available at a cost below that of simple S/S models. |
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UNIQUE MODULAR MAGNET ARRAY
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The STILETTO SERIES magnetron sputtering sources feature a unique "modular magnet array" which is completely isolated from the cooling water to eliminate magnet deterioration and subsequent degradation of source performance. This design permits access to the internal magnet arrangement thus allowing the same source to be:
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● Operated as a balanced magnetron
● Configured for maximum target utilization
● Configured for high or low rate sputtering
● Operated in a variety of unbalanced magnetron configurations
● Changed for uniform or intentionally non-uniform depositions
● Configured for high or low electron energies as they arrive at the substrate surface
● Operated with thick magnetic material targets, facilitating easy magnetic target removal and replacement |
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IN-SITU TILT FOR OPTIMUM UNIFORMITY
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Above left: Deposition uniformity with ST20 (3) Source Cluster Flange featuring in-situ tilt focused on rotating, 4.0" diameter, Si wafer. TiN / AlN co-deposition shows < +/- 1% uniformity (ellipsometer measurement). |
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For angled sputtering configurations with rotating substrates, ST20 sources are typically fitted with the "in-situ tilt" option. This option, shown above, allows the source angle to be precisely adjusted from outside the vacuum chamber. Fine tuning the incident angle is critical to achieving good deposition uniformity when working distances, operating pressures and materials are changed. While fixed angle arrangements limit and often compromise the capabilities of a system, "in-situ tilt" can deliver better than +/- 1.5% uniformity on substrates which can be up to triple the diameter of the source targets. |
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HV MAGNETRON SPUTTERING SOURCE CLUSTER FLANGES
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AJA International, Inc. STILETTO SERIES magnetron sputtering sources can be mounted to a wide variety of cluster flange configurations. By incorporating the manual tilt, in-situ tilt or linked in-situ tilt options, the focal point of the sources can be adjusted to optimize uniformity for different working distances and materials. Conventional sputtering wisdom suggests that to achieve good uniformity for different working distances and materials, the source must be larger than the substrate. With a variable tilt angle however, excellent uniformity is achievable with sources which are smaller than the substrate. For example, uniformities of better than +/- 1% have been achieved on Ø 4.0" substrates with angled ST20 sources (Ø 2.0" target) and simple substrate rotation. For users building their own system, incorporating an AJA cluster flange with in-situ tilt and an AJA rotating, heated, RF biasable substrate holder, can guarantee proven performance and eliminate design errors which limit system performance and flexibility.
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● UHV in-situ tilt configurations to vary incident angle
● Compact, fixed angle configurations with flip-top shutters
● ISO, CF, wire seal, base plate, top plate and dished head versions available
● Individual source gas rings for reactive sputtering applications
● Integrated source shutter packages with automated controllers
● Individual shielding chimneys to eliminate cross-contamination and reduce operating pressure to less than 0.5mTorr |
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FEATURES / TYPICAL APPLICATIONS
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FEATURES |
TYPICAL APPLICATIONS
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● Modular Magnet Array isolated from cooling water
● Magnetic material sputtering of thicker targets
● Easy removal of larger magnetic targets
● Integral gas injection and chimney system
● Efficient target cooling with no vacuum/water seals
● Clamped target mounting for optimal heat transfer
● RF & DC Compatibility
● Rugged HV Construction
● Operating pressure (0.5 to 1.0 Torr)
● In-situ tilt or manual tilt for optimum uniformity
● Custom versions available
● Source/Power Supply/Target packages available |
● CD / DVD Disk Coatings (e.g. reflective, phase change)
● Semiconductor
● Conductive Metal / Resistive Metal / Insulating Films
● Transparent Electrical Conductors (e.g. ITO)
● Optical Communications Applications (e.g. pump lasers)
● Lens Coatings (reflective / anti-reflective / hard / color)
● Precious Metals (for maximum target utilization)
● Thin Film Sensors
● Coatings for Surgical / Medical Implements & Implants
● Magnetic Storage Media and Heads (HD, GMR , TMR)
● Photovoltaic Thin Films (solar cells)
● Wear Resistant Films
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RF AUTOMATCHING:
Networks feature one vacuum and one air capacitor for optimum reliability. Air cooling is standard on smaller units. |
300 watt
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A300RF / A300MU
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600 watt
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A600RF / A600MU |
1000 watt
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A1000RF / A1000MU
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LOW POWER RF:
Integrated PS / manual match box makes this package ideal for small sources. |
100 watt
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A100RF / A100MM
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300 watt
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A300RF / A300MM |
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PULSED DC :
These modules / power supplies modulate the DC output to prevent arcing, increase rate or ionize the sputtered material. |
20 kHz
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ASPL-20
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Variable
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ASPL-V |
HIPIMS
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Sinex 2.0, 4.0, 8.0 |
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DC POWER SUPPLIES:
Supplies feature efficient switching technology, power/current/voltage regulation, arc supression, remote connector and interlocks. |
500 watt
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A500 DC
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1000 watt
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A1000 DC |
1500 watt
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A1500 DC
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DCXS SERIES:
Supplies are fully programmable with process storage & power ramping to reduce thermal stress on the targets. |
750 watt
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DCXS-750-3 / DCXS-750-5
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1500 watt
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DCXS-1500-3 / DCXS-1500-5 |
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SPUTTERING TARGETS & EVAPORATION MATERIALS
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AJA International, Inc. offers a variety of sputtering targets to satisfy virtually any requirement. Targets available in a wide range of materials, sizes and purities. If you don't see the material options you are looking for please don't hesitate to call or email your requirements as custom projects are our specialty. |
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FABRICATION OPTIONS
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● MACHINED
● HOT PRESSED
● VACUUM MELT
● STANDARD & CUSTOM BACKING PLATES
● PURITIES FROM 99.0% - 99.999%
● METALIC & EPOXY BONDING
● HIGH TEMP ELASTOMER BONDING |
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TYPES OF MATERIALS AVAILABLE
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● OXIDES
● BORIDES
● NITRIDES
● SELENIDES
● FLOURIDES |
● SILICIDES
● SULFIDES
● CARBIDES
● ALLOYS
● PURE METALS
● NON-METALS
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FOR A COMPREHENSIVE LIST OF MATERIALS SOLD PLEASE VISIT OUR
TARGETS AND MATERIALS PAGE. |
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