AJA International, Inc. Evaporation Systems are available in three versions: ATC-E, ATC ORION-E (taller versions of the popular ATC and ATC Orion Series Sputtering Systems) and PVDX (a through-the-wall box coater configuration). These systems are designed to deliver maximum performance and quality for limited budgets. Available in both HV and UHV versions, these units inherit many design features and common parts from the highly evolved ATC & ATC ORION sputtering tools and can be outfitted with single or multi-pocket, linear and rotary e-beam sources, thermal evaporation sources, ion / plasma sources, Knudsen cells, low temperature evaporation cells for organic materials, Radak Sources, and magnetron sputter sources. In addition, these systems are available with load-locks, QCM monitoring and control, heated or cooled substrate holders, planetaries, various pumping packages and automated control.

AJA’s offers a wide variety of evaporation sources on the ATC-E, ATC ORION-E and PVDX-E deposition systems. The vertical cylinder ATC-E and ATC ORION-E UHV chambers are best suited to linear, multi-pocket, UHV, e-beam sources which are side mounted and fitted to a convenient slide rail for service and loading access. Spare ports on the chamber bottom straddling the linear e-beam source allow for the addition of up to 4 thermal evaporation sources. The smaller ATC ORION chambers are ideally suited to multiple, small, thermal evaporation sources (k-cell, resistive boat, Radak, low temp organic) often in combination with magnetron sputter sources. The PVDX-E cylindrical back, HV, box coaters with large loading doors are generally fitted with rotary pocket e-beam sources, resistive thermal sources and some form of planetary substrate carrier to handle multiple substrates per batch.

AJA International, Inc. can fit your customized evaporation system with a wide variety of substrate holders including motorized, rotating substrate holders and planetaries to achieve excellent uniformity, heating up to 850 °C (special heaters to 1000 °C are available for small substrates), substrate RF and DC bias capability, in-situ manual or motorized Z motion (for working distance adjustment and load-lock transfer) and in-situ mask exchange (available only with certain configurations). Cooled substrate carriers (air / water / LN 2 / LHe) are also available depending on the application requirement. Process gas ring or gas distributor options are offered for reactive processing or applications requiring an anneal step.