ATC ORION SERIES SPUTTERING SYSTEMS

 

GENERAL INFORMATION

 

The AJA International, Inc. ATC ORION Series Sputtering Systems are compact versions of the popular ATC Series designed to deliver maximum performance for limited budgets. These HV and UHV systems inherit many design features and common parts from the highly evolved ATC-V & ATC-F sputtering tools and offer some unique features such as TUNING CHIMNEYS (patent applied) designed to optimize deposition uniformity. The standard ATC ORION modules (chambers, frames, cluster flanges, etc.) are generally in stock at AJA reducing delivery time. These systems use AJA's exclusive Stiletto (HV) and A300-XP (UHV) magnetron sputtering sources (2" and 3") and can be fitted with heating and cooling stages to accommodate substrates up to 6" diameter. Substrate temperature ranges from LN2 to 1000°C available depending on size and configuration.

 

 

TYPICAL SPUTTERING SYSTEM CONFIGURATIONS

 

ATC ORION 3 UHV

1-3 UHV MAGNETRON SPUTTERING SOURCES

ATC ORION 5 UHV

1-5 UHV MAGNETRON SPUTTERING SOURCES

 

ATC ORION 4 HV

1-4 HV MAGNETRON SPUTTERING SOURCES
SHOWN W/ TURBO PUMP VACUUM LOAD LOCK

ATC ORION 5 HV

1-5 HV MAGNETRON SPUTTERING SOURCES
SHOWN WITH NITROGEN GLOVE BOX

 

ATC ORION 8 UHV

FITS UP TO (8) 2" UHV MAGNETRON SPUTTERING SOURCES - SHOWN W/ VACUUM LOAD LOCK

ATC ORION 8 HV

FITS UP TO (4) 3" HV MAGNETRON
SPUTTERING SOURCES

 

 

TYPICAL RATE / UNIFORMITY DATA

 

Deposition of SiO(2) on 100mm diameter Si wafer at 150 Watts, 3mTorr, 5.5" working distance. Uniformity is ± 2.08%

 

The ATC ORION Series Sputtering Systems feature a con-focal sputter source flange oriented at specific angles determined from many years of experience with the in-situ tilt sources found on the ATC-V and ATC-F systems. The specially designed chimney/ground shield/shutter system allows a high degree of deposition uniformity over substrates over twice the target diameter. A typical deposition profile with SiO(2) on a 4" diameter Si wafer is shown below.

Deposition rate is a function of sputter yield of the material, maximum allowable power density into the target (depends on heat transfer capability of target material), and type of power used (eg. RF, DC, pulsed DC).

 

Maximum deposition rates are achieved with materials such as Au - high sputter yield, excellent heat transfer material and can be sputtered with DC (most efficient). Slow deposition rates can be expected with materials such as Al(2)O(3) - very low sputter yield, poor heat transfer material and must be sputtered with RF (1/2 the efficiency of DC). Typical rates are 0-18 Å/sec with Au, 0-9 Å/sec with Cu and 0-0.16 Å/sec with Al(2)O(3).

Direct deposition at short working distances can achieve higher rates but con-focal geometry results in better uniformity, the ability to co-deposit alloy films and the ability to grow better ultra-thin film multilayers since the substrate is always "in the plasma."

 

 

MAGNETRON SPUTTERING SOURCE CLUSTER FLANGES

 

AJA's Stiletto-O (HV) and A300-XP-O (UHV) magnetron sputtering sources (2" & 3" target sizes) are designed specifically to fit cluster flanges for the compact ATC ORION Systems. They feature tunable isolation chimneys with gas injection and flip-top shutters to accommodate compact spaces and custom chimney designs. The basic magnetron/cathode assembly is identical to the unique AJA A300 Series modular magnetrons which are used in the ATC-V and ATC-F systems. The magnet array can be configured by the customer to operate in the balanced, unbalanced (Type II) and magnetic material modes. Due to the compact design, the complete shutter, isolation chimney and ground shield assembly is quickly removed with only two screws for easy target access.

 

ATC ORION 8 CLUSTER FLANGE
ACCEPTS UP TO (5) 3" SOURCES

ATC ORION 8 CLUSTER FLANGE
ACCEPTS UP TO (8) 2" SOURCES

   

ATC ORION 4 HV
SPUTTER DOWN CLUSTER FLANGE

ATC ORION 3 UHV
SPUTTER UP CLUSTER FLANGE

 

 
SUBSTRATE HOLDERS / HEATERS
 

The con-focal ATC ORION systems utilize motorized, rotating substrate holders to achieve excellent uniformity, allow the co-deposition of alloy films and facilitate the deposition of pristine ultra-thin film multilayers since the substrate is always "in the plasma". These substrate holders can be heated up to 850 °C (special heaters to 1000 °C are available for small substrates) and feature reactive gas injection rings, substrate RF and DC bias capability, in-situ manual or motorized Z motion (for working distance adjustment and load-lock transfer) and in-situ mask exchange (available only with certain configurations).

Custom cooled substrate carriers (air / water / LN 2 / LHe) are also available depending on the application requirement.

 
 
PHASE II-J COMPUTER CONTROL

 

 

 

AJA International’s Labview based Phase II-J computer control system is used on all ATC systems including the ATC ORION versions. This straightforward, user friendly control system utilizes a large, flat-screen laptop in a 19” rack drawer connected to a single 7” high x 19” wide rack mount hardware module. The back panel of the hardware module is populated with connectors to interface to all aspects of the sputtering system.

The Phase II-J control system allows the user to operate in either the “manual mode” or the “automated processing mode”. In the “ automated processing mode” the user designs process “layers” which are then compiled and saved as a “process”. The system allows 10 unique user entry points which are accessable only by password, limiting access to a user’s layers and preventing unexpected corruption of a user’s saved processes.

The standard Phase II-J control system will accommodate up to (5) DC power supplies, (4) RF power supplies, (1) 4-way DC switchbox, (1) 3-way RF switchbox, (4) process gases , closed loop automatic pressure control and substrate temperature control. Processes are aborted if plasma is not detected. Special “soak layers” can be easily incorporated into the process. Finally, data logging is standard with an adjustable refresh period. Process data can be downloaded to common spreadsheet programs.

 

 
TYPICAL AJA SPUTTERING SYSTEM SCHEMATICS

 

ATC ORION 5 UHV SPUTTER UP

ATC ORION 5 HV SPUTTER DOWN

 

 

 

SYSTEM OPTIONS
 

Substrate Heaters

Sputter Down Cluster Flanges

Sputter Up Cluster Flanges

 

Vacuum Pumping

Turbo-Pumped Load Lock

Power Distribution Modules

 

Nitrogen Glove Box Load Lock

MFC Gas Handling

Computer Control

 

RF & DC Power Supplies

Targets

Automatic Pressure Control