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ATC FLAGSHIP SERIES SPUTTERING SYSTEMS
General Information
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AJA International ATC Flagship Series Sputtering Systems are versatile PVD coating tools which can be built in a variety of configurations to satisfy most requirements. These systems are built around AJA's unique A300-XP (UHV) or Stiletto Series (HV) magnetron sputtering sources which feature in-situ source head tilting allowing precise and repeatable con-focal, direct, and off-axis thin film deposition. All systems include a heavy duty hoist to lift the chamber top for system access.
Systems are available in the following chambers sizes:
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(e-beam evaporation, thermal evaporation and PLD) , ion sources, facing target sputtering sources (FTS), contact masking systems, metal-sealed tops, bake jackets, glove boxes, cassettes, auto-loading and analytical tools (RHEED, XPS, Auger, RGA, Ellipsometers and MOS).
Labview based computer control and either turbomolecular or cryopumping are utilized depending on the application. ATC Flagship Systems can also be easily connected to each other or to ATC Orion Systems for multi-chamber (e.g. metal/oxide) or multi-technique (e.g. sputter/e-beam evaporation/thermal evaporation/PLD/ion milling/analytical) configurations. |
TYPICAL flagship Sputtering system configurations
ATC 1800 UHV - Standard Con-Focal
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ATC 1800 UHV
(5) con-focal A320-XP 2" UHV sputter sources with in-situ tilt, (1) normal incidence A330-XP-3” UHV sputtering source for high rate applications, CTI-8 cryopump, 850°C rotating substrate heater with RF bias, computer control & load-lock for 100 mm Ø substrates. |
ATC 2200 UHV - 9 Position Cassette Auto-Loading
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ATC 2200 UHV
(6) A330-XP 3" UHV sputter sources with in-situ tilt, 1200 l/s turbopump, 800°C, rotating substrate heater with RF bias, computer control and automated (9) substrate cassette elevator in the load-lock for 150 mm Ø substrates. |
ATC 2200 UHV - Combinatorial Chemistry Configuration
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ATC 2200 UHV
(6) A330-XP (3" target) in-situ tilt, sputter sources are employed to deposit a circular array of discrete, combinatorial dots onto wafers or 156 mm square glass substrates. The same system can also be used to deposit continuous gradients from up to six directions simultaneously. |
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Refraction of SiO2 film showing gradient deposition
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Circular Array of Discrete Combinatorial Dots on wafer and glass square substrates
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ATC 2200 UHV - 10 to 13 Source GMR/MTJ Research System
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ATC 2200 UHV
(11) Source GMR/MTJ research system with auto-loading and 6 position cassette. |
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11 Source GMR/MTJ Research System
(8) A320-XP 2" sources and (3) A315-XP 1.5" sources for GMR/MTJ research |
13 Source GMR/MTJ Research System
(2) A320-XP 2" sources for MM targets and up to (11) A315-XP 1.5" sources for GMR/MTJ films |
ATC 2200 HV - Direct Sputter High Rate Turret Coater
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ATC 2200 HV
High rate direct sputter Turret Coater for 4" wafers. Wafers can be flipped in-situ and coated on both sides. Turret incorporates (4) STX-150 (6") magnetron sources and a 1000 W RF power supply/matchbox with integral, automatic, (4) way switchbox. |
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STX-150-4 Axial Turret
compatible with 1000 W RF |
STX-150-4T Axial Turret
with gas ring and removable shield |
ATC 2600 UHV - Direct Sputter 12 Source Coating Tool
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ATC 2600 UHV
(12) Source direct sputter coater for (8) 1" samples. Sample positioning is stepper motor controlled and programmable. |
TYPICAL RATE / UNIFORMITY DATA
The ATC Series Thin Film Deposition Systems can be configured for con-focal, direct, and off-axis deposition. Con-focal deposition with in-situ tilt sputter sources (AJA pioneered and developed this concept in 1991) can deliver uniformity of better than +/- 2% on substrates twice the diameter of the targets. Often +/- 1% or better is achievable. A typical deposition profile with SiO(2) on a 6" diameter Si wafer is shown.
Deposition rate is a function of sputter yield of the material, maximum allowable power density into the target (depends on heat transfer capability of target material), and type of power used (e.g. RF, DC, pulsed DC).
Maximum deposition rates are achieved with materials such as Au - high sputter yield, excellent heat transfer material and can be sputtered with DC (most efficient). Slow deposition rates can be expected with materials such as Al2O3 - very low sputter yield, poor heat transfer material and must be sputtered with RF (1/2 the efficiency of DC). Typical rates are 0-18 Å/sec with Au, 0-9 Å/sec with Cu and 0-0.16 Å/sec with Al2O3 in a confocal configuration with 2" sources on a 100 mm diameter substrate. Off-axis deposition rates are typically 1-5 times lower than con-focal deposition rates depending on substrate size and system configuration.
Direct deposition at short working distances (50-100 mm) can achieve rates as high as 300 Å/sec but con-focal geometry results in much better uniformity, the ability to co-deposit alloy films and the ability to grow better ultra-thin film multilayers since the substrate is always "in the plasma." The cost of the smaller targets employed in con-focal configurations can also significantly reduce operating cost. The ultimate system configuration offered will always depend on the application.
Deposition rate is a function of sputter yield of the material, maximum allowable power density into the target (depends on heat transfer capability of target material), and type of power used (e.g. RF, DC, pulsed DC).
Maximum deposition rates are achieved with materials such as Au - high sputter yield, excellent heat transfer material and can be sputtered with DC (most efficient). Slow deposition rates can be expected with materials such as Al2O3 - very low sputter yield, poor heat transfer material and must be sputtered with RF (1/2 the efficiency of DC). Typical rates are 0-18 Å/sec with Au, 0-9 Å/sec with Cu and 0-0.16 Å/sec with Al2O3 in a confocal configuration with 2" sources on a 100 mm diameter substrate. Off-axis deposition rates are typically 1-5 times lower than con-focal deposition rates depending on substrate size and system configuration.
Direct deposition at short working distances (50-100 mm) can achieve rates as high as 300 Å/sec but con-focal geometry results in much better uniformity, the ability to co-deposit alloy films and the ability to grow better ultra-thin film multilayers since the substrate is always "in the plasma." The cost of the smaller targets employed in con-focal configurations can also significantly reduce operating cost. The ultimate system configuration offered will always depend on the application.
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A330-XP UHV Magnetron Sputter Source
In-situ tilt in con-focal orientation for uniform deposition onto 150 mm Ø substrate. |
SiO2 film thickness measurements over
a 150 mm diameter Si wafer coated in a standard ATC 2200. This particular ATC 2200 was configured with (6) 3" A330-XP UHV magnetron sputter sources featuring in-situ tilt. This film was deposited by a single 3" source in a single run and achieves +/- 1.17% uniformity over 140mm diameter. |
SPUTTERING SOURCES
(6) A320-XP UHV Magnetron Sputter Sources
In-situ tilt in a con-focal orientation for uniform deposition onto 100 mm Ø. |
AJA's exclusive Stiletto (HV) and A300 (UHV) Series Magnetron Sputtering Sources are designed for maximum application flexibility. These unique sources feature a modular magnet array which can be configured by the customer to operate in the balanced, unbalanced (Type II) and magnetic material modes. Gas injection chimneys and shutter systems are incorporated to facilitate in-situ tilting and prevent cross-contamination and target poisoning. 3" and 4" sources can be operated at pressures below 4 x 10-4Torr in combination with an ion source to perform IBAD at half the price and complexity of an ion beam assisted ion beam sputtering system.
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The Unique AJA Modular Magnet Array & In-situ Tilting Features
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The A300XP series and Stiletto Series feature a unique “modular magnet array” which is completely isolated from the cooling water to eliminate magnet deterioration and subsequent degradation of source performance. This design permits access to the internal magnet arrangement thus allowing the same source to be:
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For angled sputtering configurations with rotating substrates, AJA International Inc. sputtering sources can be fitted with the “in-situ tilt” option. This option, shown at the left, allows the source angle to be precisely adjusted from outside the vacuum chamber. Fine tuning the incident angle is critical to achieving good deposition uniformity when working distances, operating pressures and materials are changed. When fixed angle arrangements limit and often compromise the capabilities of a system, “in-situ tilt” can deliver better than +/- 2% uniformity on substrates which can be up to triple the diameter of the source targets.
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SUBSTRATE HOLDERS - HEATING / COOLING
The ATC Series Thin Film Deposition Systems are available with either motorized, rotating, substrate holders (for con-focal configurations) or "T" arm substrate holders (for direct deposition). AJA's experienced design and manufacturing team also offers custom substrate holders to satisfy unique requirements. SHQ and SiC Series substrate heaters can achieve temperatures of up to 1000°C and can be fitted with reactive gas injection rings, substrate RF/DC bias capability for pre-cleaning and ion assisted deposition, in-situ manual or motorized Z motion for working distance adjustment and load-lock transfer, transverse magnetic field with in-situ orientation adjustment between layers and in-situ mask exchange (available with certain configurations). Indexing for "T" arms and for gradient depositions on rotating holders is accomplished with precise stepper motor systems. Electronic triggers for analytical applications are also available.
AJA manufactures its own PID based temperature controllers and joystick actuated motor controllers for rotation and Z motion. AJA SHQ Series substrate heaters utilize cost effective, durable, fast cycling, quartz halogen lamp technology while the highest temperatures are achieved with Silicon Carbide elements.
Custom cooled substrate carriers (water/LN2) are also available depending on the requirement.
AJA manufactures its own PID based temperature controllers and joystick actuated motor controllers for rotation and Z motion. AJA SHQ Series substrate heaters utilize cost effective, durable, fast cycling, quartz halogen lamp technology while the highest temperatures are achieved with Silicon Carbide elements.
Custom cooled substrate carriers (water/LN2) are also available depending on the requirement.
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8 Position Substrate Holder
Custom, stepper motor driven, indexable, for 50 mm Ø substrates. This component is compatible with load-locks and both manual and automated loading systems. |
1.5 Liter LN2 Reservoir
Attachments for 100mm Ø transfer plate. This cooled holder features rotation, motorized Z-motion, and a castellated transfer plate to eliminate the protrusion of mounting clips. |
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SiC Series 1000°C Substrate Heater
Rotation, RF/DC bias capability, and motorized Z- motion for 100 mm Ø substrates. |
SHQ Series Quartz Lamp Heater
800°C for 150mm Ø substrates featuring motorized Z-motion, rotation and a swing-in QCM for rate calibration. |
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T Arm SHQ/H2O/RFB
Double ended T arm substrate carrier. One side has 1000°C heating with RF biasing, the other side incorporates water cooled heat sinking to cool down substrates before exposure to air. |
SHQ Series Quartz Lamp Heater
1000°C for 1.5" Ø substrates featuring transferable substrate carrier and gas injection frame. |
PHASE II-J COMPUTER CONTROL
The AJA Labview based Phase II-J Computer Control System is used on all ATC Flagship Series Sputtering Systems. This straightforward, user friendly control system utilizes a large screen laptop in a 19” rack drawer connected to a single 4U rack mount hardware module. The back panel of the hardware module is populated with connectors to interface to all aspects of the sputtering system and to allow for easy future "plug and play" upgrades/expansions.
The Phase II-J control system allows the user to operate in either the “manual mode” or the “automated processing mode”. In the “automated processing mode” the user designs "process layers” which are then compiled and saved as a “process” to be executed with a single command. The system allows up to 104 unique user entry points which are accessible only by password, limiting access to a user’s process layers and thereby preventing unexpected corruption of a user’s saved processes. Data-logging to a Microsoft Excel spreadsheet is standard and is available with an adjustable refresh period. Remote preparation of new processes in a spreadsheet emulator format is available as an option.
The standard Phase II-J control system will accommodate up to (5) DC power supplies, (4) RF power supplies, (1) 4-way DC switch-box, (1) 4-way RF switch-box, (4) process gases, (16) Valves/shutters, closed loop automatic pressure control, substrate rotation and substrate temperature control. Processes are aborted if plasma is not detected. Special “soak layers” can be easily incorporated into the process.
The Phase II-J control system allows the user to operate in either the “manual mode” or the “automated processing mode”. In the “automated processing mode” the user designs "process layers” which are then compiled and saved as a “process” to be executed with a single command. The system allows up to 104 unique user entry points which are accessible only by password, limiting access to a user’s process layers and thereby preventing unexpected corruption of a user’s saved processes. Data-logging to a Microsoft Excel spreadsheet is standard and is available with an adjustable refresh period. Remote preparation of new processes in a spreadsheet emulator format is available as an option.
The standard Phase II-J control system will accommodate up to (5) DC power supplies, (4) RF power supplies, (1) 4-way DC switch-box, (1) 4-way RF switch-box, (4) process gases, (16) Valves/shutters, closed loop automatic pressure control, substrate rotation and substrate temperature control. Processes are aborted if plasma is not detected. Special “soak layers” can be easily incorporated into the process.
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Labview Computer Control
Large screen laptop on convenient slide drawer for Labview based ATC system computer control. Replacement laptops are always in stock. |
Computer Control Module Phase IIJ PLC
Compact 4U rack mount case. This module is fitted from the outset with all receptacles for quick field retrofits/upgrades. |
SYSTEM OPTIONS
HV and UHV Magnetron Sputter Sources with
In-Situ Tilt 
Turbomolecular and Cryogenic Vacuum Pumps
Bake-out Jackets
Load-Locks with In-Situ Contact Mask Exchange
Labview based Computer Control on convenient slide drawer
Sputtering Targets
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Turbo pumped Load-lock with 9 position Cassette and Auto-loading
RF, DC, Pulsed DC and HIPIMS Power Supplies
Easy Access,Tip-In, Utility Boxes for Pneumatics Cooling/Flow Sensors and for
Non- Hazardous Gases 
Mini Hazardous Gas Box for H2S with N2 purge, gas detector and double walled feed to chamber
Power Distribution Modules for 208V and
380V systems 
Automatic Closed-Loop, Downstream
Pressure Control with alternate Position Mode for Upstream Control |