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R & D MAGNETRON SPUTTERING SOURCES (HV AND UHV)
General Information
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AJA International, Inc. has developed well over 100 different types of magnetron sputtering sources since 1991 including many sources specifically designed for specialty applications. Unique rectangular, circular, turret and cylindrical versions are offered depending on the substrate geometries, chamber configurations, target material constraints and the desired film specification. See further details below or contact AJA about your requirements.
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Unique Modular Magnet Array
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AJA's magnetron sputtering sources feature a unique "modular magnet array" which is completely isolated from the cooling water to eliminate magnet deterioration and subsequent degradation of source performance. This design permits access to the internal magnet arrangement thus allowing the same source to be:
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- Operated as a balanced magnetron
- Configured for maximum target utilization
- Configured for high or low rate sputtering
- Operated in a variety of unbalanced magnetron configurations
- Changed for uniform or intentionally non-uniform depositions
- Configured for high or low electron energies as they arrive at the substrate surface
- Operated with thick magnetic material targets
- Optimized for easy magnetic target removal and replacement
Typical Performance
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ST20 / A320-XP
This data is for 2" UHV and HV magnetron sputter sources configured in an unbalanced mode for maximum rate, target utilization and film density. Deposition orientation is direct and shown at different working distances. Operating Pressure was 3.0 mTorr and a Cu target was run at 100 Watts. Uniformity over a 4 cm diameter substrate was +/- 2.9% at 3", +/- 1.9% at 4" and +/- 1.0% at 5". |
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ST30 / A330-XP
This data is for 3" UHV and HV magnetron sputter sources configured in an unbalanced mode for maximum rate, target utilization and film density. Deposition orientation is direct and shown at different working distances. Operating Pressure was 3.0 mTorr and a Cu target was run at 100 Watts. Uniformity over a 4 cm diameter substrate was +/- 0.7% at 3", and less than +/- 0.1% at 4". Uniformity over an 8 cm diameter substrate was +/- 3.25% at 4", +/- 2.05% at 5" and +/- 1.48" at 6". |
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ST2080
The data shown above is measured at 3 working distances over the ST2080 in the long direction. The source was tested with a Cu target at 4 mTorr and running at 1400 W (2505 mA, 558 V). Uniformity over 6" at a 4" working distance is +/- 3.2%. |
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A320-XP / ST 20
Discharge Voltage as a function is shown for both 2" sources running at 200 W DC power. |
Typical Features
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Typical Applications
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Stiletto Series HV Magnetron Sputtering Sources
Stiletto Series Circular Magnetron Sputtering Sources
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The AJA Stiletto Series Circular Magnetron Sputtering Sources have been designed to meet the most challenging needs of the thin film research community for high vacuum applications while maintaining flexibility and features of the world class A300-XP Series UHV sources. Circular Target Stiletto Sources available in the following sizes:
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ST 40 / ST 20 Sources
on 12" HV mounting stalks with UBQD Option |
ST 40-MM Source
Shown with 4" Fe target on integral jacking platform for easy target exchange. |
Stiletto Series Rectangular Magnetron Sputtering Sources
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The AJA Stiletto Series Rectangular Magnetron Sputtering Sources have been designed to meet the most challenging needs of the thin film research community for high vacuum applications while maintaining flexibility and features of the world class A300-XP Series UHV sources. Rectangular Target Stiletto Sources available in the following sizes:
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(2) ST 2080 Rectangular Sources
Custom Configured for Facing Target Deposition with adjustable spacing. |
ST 2056 Rectangular Source
On 1.5" OD support for compression seal mounting. |
End Mounted ST1580 - For Coating Inside Tubes
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Coating inside tubes can be difficult since most sputter sources are too large and not end mounted. AJA has developed low profile, rectangular magnetrons for 5" and 8" long targets.with long support tubes. By inserting the source into the end of a rotating, tubular substrate and moving either the source or the substrate in a linear fashion, the inside of the tube can be uniformly coated. AJA also has custom designs for small conical target units for tubes as small as 2" in diameter.
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A300-Xp Series UHV Magnetron Sputtering Sources
A300-XP UHV Magnetron Sputtering Sources
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The AJA A300-XP UHV Magnetron Sputtering Sources are the next generation, "expanded performance" version of the industry standard A300 SERIES magnetron sputtering sources that have dominated the high end, UHV sputter gun market since 1991. New "expanded performance" features include higher pressure operation, improved magnetic material sputtering performance, and a larger product range. Although our competitors have attempted to incorporate certain "AJA innovations" into their product lines during the last 10 years, the new A300-XP source developments will continue to ensure AJA's position well ahead of the pack in the UHV magnetron market.
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A320-XP Source
Shown above is a typical A320-XP 2" UHV source with in-situ tilt, pneumatic shutter, gas ring, conical chimney and integral gas injection. |
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A340-XP Source
4" Target UHV magnetron sputtering source on 8" CF rotatable flange (bolt ring not shown) with chimney, gas ring and pneumatic shutter. |
A330-XP Source
UHV magnetron sputter source with in-situ tilt shown in a con-focal orientation for uniform deposition onto 150 mm Ø substrates. |
A310 Series Miniature UHV Magnetron Sputtering Sources
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AJA’s unique A310-XP source fits through the port of a 2.75” CF flange. Target changes can be made with one hand either inside or outside of the chamber. This revolutionary design is full ceramic to metal construction. These sources can also be combined into multi-gun clusters.
The design is ideal for Surface Science chambers and anyone working with small substrates (up to 2” Ø). The A310-XP is suitable for RF and DC operation. |
CTM Series Magnetron Sputtering Sources
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In 1994 AJA was awarded a joint patent with the U.S. Air Force for the CTM (Conical Target Magnetron) designed to provide efficient off axis deposition of HiTC superconductors. Variations have since been created. Most current applications are based on minimizing damage due to high energy ions or neutrals. One particularly interesting application is the deposition of conductive oxides such as ITO for displays. These sources all feature integral process gas distribution and are available in both HV and UHV versions.
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A3CV Series UHV magnetron Sputtering Sources
The AJA A3CV series magnetron sputtering sources feature the unique ability to fit multiple target modules onto a common source head subassembly. This flexibility is ideal for R&D applications where the user wishes to sputter various size targets (large magnetic, small precious metal, standard size and custom size) without incurring the cost of multiple sources. A3CV sources are available in both HV and UHV mounting versions. All sources are RF and DC compatible. Gas injection chimneys, source head tilt gimbals, integral shutters and power supplies are optional. A3CV Series sources also feature the unique AJA “modular magnet array”.
A3CV Source Variations
Clockwise from far left: 2" version with manual tilt, gas injection chimney, 2.5" version on 6"Cf flange, gas injection chimney showing gas channel, 3" magnetic material version, 2" module, magnetic version core, magnetic version module.
Clockwise from far left: 2" version with manual tilt, gas injection chimney, 2.5" version on 6"Cf flange, gas injection chimney showing gas channel, 3" magnetic material version, 2" module, magnetic version core, magnetic version module.
options FOR UHV & HV magnetron sputtering SOURCES
In-Situ Tilt for Optimum Uniformity
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For angled sputtering configurations with rotating substrates, AJA R&D sources are typically fitted with the "in-situ tilt" option. This option, shown above, allows the source angle to be precisely adjusted from outside the vacuum chamber. Fine tuning the incident angle is critical to achieving good deposition uniformity when working distances, operating pressures and materials are changed. While fixed angle arrangements limit and in some ways compromise the capabilities of a system, "in-situ tilt" can deliver better than +/- 1.5% uniformity on substrates which can be up to triple the diameter of the source targets.
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A320-XP Complete Source
This shows a typical A320-XP 2" UHV source with in-situ tilt, pneumatic shutter, gas ring, conical chimney and integral gas injection. |
Deposition uniformity with an ST20 (3) source cluster flange featuring in-situ tilt focused on a rotating, 4.0" Ø, Si wafer. TiN / AlN co-deposition shows < +/- 1% uniformity (ellipsometer measurement)
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Chimney / Gas Ring
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AJA offers conical, cylindrical and high particulate versions of source chimneys. The designs generally incorporate a gas ring in the base of the chimney - sheet injection for smaller sources and individual channels for larger guns. For sources that do not tilt, chimney inserts can be used to enhance uniformity. For ultra low rate doping applications, chimneys can be fitted with grids to reduce rates up to 95%. Surfaces are alumina grit blasted for maximum adhesion. Specialty coatings and water cooled chimneys are available for some applications.
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Source Shutters
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AJA R&D magnetron sputter sources are available with shutters which optically seal off the opening of the source chimney. These shutters have been engineered in a variety of configurations including:
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Modular Magnet Array and Super Magnet Pullers
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AJA HV and UHV, R&D magnetron sputter sources feature modular magnet arrays which can be converted to operate in balanced, unbalanced and magnetic material modes. A variety of high strength, high temperature rare earth magnet sizes and materials are available to optimize gun performance. A newly developed Super Magnet Puller has been developed to minimize the time required to convert magnet arrays.
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UBQD - the Perfect Quick Disconnect
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AJA has developed the perfect quick disconnect for mounting HV magnetron sources with 0.750" Ø support tubes through baseplate holes ranging in size from 1.0" to 34 mm in Ø. Unlike aluminum BQD's (whose threads are easily stripped) or S/S BQD's (which can easily scratch the support tube), the AJA UBQD uses a stainless body, a PTFE glide ring to protect the tube and an atmosphere side brass nut to prevent galling of the threads. It also includes an adapter ring for 32-34 mm baseplate holes and is economically priced.
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magnetron SOURCE configurations/COMBINATIONS
Magnetron Sputtering Source Cluster Flanges
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The AJA magnetron sputtering sources can be mounted to a wide variety of cluster flange configurations. By incorporating the manual tilt, in-situ tilt or linked in-situ tilt options, the focal point of the sources can be adjusted to optimize uniformity for different working distances and materials. Conventional sputtering wisdom suggests that to achieve good uniformity for different working distances and materials, the source must be larger than the substrate. With a variable tilt angle however, excellent uniformity is achievable with sources which are smaller than the substrate. For example, uniformities of better than +/- 1% have been achieved on 4.0" Ø substrates with angled A320-XP and ST20 sources
(2.0" Ø target) and simple substrate rotation. For users building their own system, incorporating an AJA cluster flange with in-situ tilt and an AJA rotating, heated, RF biasable substrate holder, can guarantee proven performance and eliminate design errors which limit system performance and flexibility. As the world leader in flexible magnetron sputtering source design, AJA also manufactures many varieties of UHV cluster flanges which integrate anywhere from (2) to (12) A300-XP series magnetron sputtering sources onto a single vacuum flange. With the increasing demand for co-deposited thin films of varying stoichiometries and both magnetic and non-magnetic multilayers, AJA cluster flanges offer the most extensive range of possibilities currently available on the market. |
- UHV in-situ tilt configurations to vary incident angle
- Compact, fixed angle configurations with flip-top shutters
- ISO, CF, wire seal, base plate, top plate and dished head versions available
- Individual source gas rings for reactive sputtering applications
- Integrated source shutter packages with automated controllers
- Individual shielding chimneys to eliminate cross-contamination and reduce operating pressure to less than 0.5mTorr
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Cluster Flange with Tilt
Sputter down cluster flange with in-situ tilt. |
Cluster Flange Fixed
Sputter down cluster flange with fixed angle sources and flip shutters. |
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ATC ORION 5 Cluster Flange
Flange accepts up to (5) 2” sources. |
(6) A320-XP UHV Magnetron Sputter Sources
In-situ tilt in a con-focal orientation for uniform deposition onto 100 mm Ø. |
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UHV Cluster Flange with (3) A320-XP
sources having in-situ tilt and long conical chimneys for operation below 0.5 mTorr. |
UHV Cluster Flange with (3) A320-XP
fixed sources fitted with flip shutters. |
Axial Turret Sputtering Sources
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The Axial Turret design locates multiple source heads, oriented axially, on the end of a rotatable support tube running through a hollow shaft, UHV, ferroflluid rotary vacuum feedthrough. The source heads are cooled and powered through the support tube and the assembly is indexed to aim the desired source at the substrate. A single port can be used to introduce multiple magnetrons into a deposition chamber. An interesting version shown has tilt gimbals on each source allowing further articulation of the source head. Turrets are available with up to 12 heads.
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Radial Turret Sputtering Sources
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The Radial Turret design locates multiple source heads, oriented radially, on the end of a rotatable support tube running through a hollow shaft, UHV, ferroflluid rotary vacuum feedthrough. The source heads are cooled and powered through the support tube and the assembly is indexed to aim the desired source at the substrate. A single port can be used to introduce multiple magnetrons into a deposition chamber. Turrets are available with up to 12 heads and integral RF/DC matchbox/switchbox modules.
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