Multi-Chamber
Coating Systems
AJA International Multi-Chamber Systems are a great solution when your process requires various deposition techniques without exposing your substrate to atmosphere, and minimizing cross contamination. This results in enhanced performance and reliability since the individual chambers are optimized for a specific process, and many utilizing standard design features that have been field tested for decades. Systems can be equipped with magnetron sputtering, electron beam evaporation, thermal evaporation, ion milling, and various in-situ analytics (Ellipsometry, RHEED, MOS, etc.). The AJA International Multi-Chamber System can be configured in a linear, right angle, or in-line orientations, utilizing common load-locks, direct connection (chamber to chamber), or in-line UHV transfer tube. These systems can be designed with manual or automated transfer and built in HV or UHV configurations.
Multi-Chamber techniques employed include:
Magnetron Sputtering
E-Beam Evaporation
Thermal Evaporation
Ion Milling
Ion Beam Deposition
Pulsed Laser Deposition
Ellipsometry
Rapid Thermal Anneal
Oxygenation and Nitridization
XPS/AUGER/LEED Analysis
MBE
RHEED
MOS
SIMS
RIBE
ATC-MC Multi-Chamber Magnetron Sputtering System with Cassette Loading and Automated Transfer Capabilities
The ATC-MC Multi-Chamber Magnetron Sputtering System allows automated in-situ transfer between two UHV deposition chambers each equipped with (5) 3” con-focal sputtering sources, (1) 6” direct sputtering source, and (1) 4cm gridded DC ion source. Sputtering sources are powered by DC, RF, and HiPIMS generators.
System is designed for up to 8” wafer handling, 800C heating, 0-40 RPM azimuthal rotation, RF/DC biasing, and 100mm z-motion adjustment. Additional features include custom bakeout jacket for chamber conditioning (< 9.0x10-10 Torr), turbo/cryo pump combination, automated crystal monitor positioning for rate calibration and data logging, and post wafer cooling via He gas.
Dual ORION UHV with
Common Load-Lock
System features both sputter and evaporation process chambers with (10) A315-O 1.5" UHV sputter sources, (1) 6-pocket 15cc UHV linear e-gun, (4) Resistive Thermal Sources, 850°C rotating substrate heaters with RF bias, secondary tilting/cooled stage, RHEED, computer control, load-lock cassette with in-situ mask exchange for 4" diameter substrates and chamber to chamber transfer system.
ATC -MC-HY Multi-Chamber Hybrid Deposition Tool with UHV Transfer Tube & Glovebox Interface
The ATC-HY Multi-Chamber Hybrid Deposition Tool combines two Hybrid Process Chambers, each featuring e-beam and thermal evaporation, confocal magnetron sputtering, ion beam etching with a 360 degree tilt, and a water-cooled substrate holder. In addition, a third process chamber features post anneal, oxygenation and ashing capability. All are connected via a UHV magnetic transfer tube with sectional isolation, integral load-lock and glovebox compatibility.
Dual ATC/Orion Series UHV Sputtering System
The dual UHV Sputtering System above allows transfer between deposition chambers without exposure to load-lock pressures. Common 2-position load-lock chamber (e10-7 Torr) is located on the far right, oxide chamber (e10-8 Torr) in the center, and UHV sputter chamber (e10-10 Torr) with bakeout jacket on the left. The UHV chamber includes both con-focal and direct sputtering optimized for deposition of superconducting Nb films. The oxide chamber includes (5) con-focal 2” sputtering sources, O2 plasma source, and both static and dynamic natural oxidation capabilities.
ATC UHV Dual Sputtering & Electron Beam Evaporation Chamber
Dual UHV ATC 1800/2200E (Sputter/ E-Beam) system with (4) A320-XP 2 " UHV sputter sources with in-situ tilt, (2) 4-pocket 15cc UHV linear e-guns, RF ion source, 1200 l/s turbopumps, 850°C rotating substrate heaters with RF bias, computer control, and common vertex load-lock for 100 mm Ø substrates.
