Magnetron Sputtering and RF Bias Etch:

The system features an RF powered, 2” magnetron (ST20) facing a water-cooled stage. RF power allows the widest range of materials – both conducting and insulating – to be used as sputtering targets. This target size is the most common and provides many low-cost options. This gives students access to the widest range of materials to explore by a simple target exchange. Samples up to 2” in diameter can be mounted by a clamp ring, while smaller samples are conveniently secured by mounting clips.

The same stage and power supply can also be utilized as a platform for exploring plasma-based etching. The concepts of plasma formation and dynamics such as self-bias can be demonstrated. The resulting sample ion bombardment which leads to beneficial surface effects can readily be demonstrated and investigated. Applications such as surface sputtering for material removal and surface activation can be observed and studied.

Multiple windows and internal lighting provide clear views of components and plasma during operation.

RF Power Supply:

A 100 W RF power supply with auto-tuning network provides power for both the sputter gun and RF stage bias. The concepts of RF power delivery and impedance matching as well as the effects of input power can be shown. Manual adjustment of these parameters provides the opportunity to explore the impact of the power delivery configuration.

Residual Gas Analyzer (RGA):

Insight into the vacuum environment is key to controlling many processes. An optional RGA allows students to gain insight into the composition of the vacuum gas after pump-down. The evolution over time of important residual components such as water vapor, the detection of leaks via oxygen or probe gases such as helium, and the outgassing of detrimental species such as hydrocarbons from in-vacuum materials can be taught and quantified. The RGA allows visualization of these important aspects of vacuum science and technology.