Speciality
Sputtering Sources
General Information
AJA International, Inc. has developed a wide range of magnetron sputtering sources since 1991 including many larger models specifically designed for production applications. Rectangular, circular, cylindrical, triangular and rotating magnet versions are offered depending on the substrate geometries, production volumes, chamber configurations, target material constraints and the desired film specification. See further details below or contact AJA about your requirement.
Nanocluster Sputtering Sources
AJA’s Nanocluster source uses simple method of controlling the size of metal nanoclusters produced by magnetron sputtering and gas-phase agglomeration. Nanocluster sizes can be achieved by using a two-gas He:Ar mixture. The average size is found to monotonically decrease as a function of increasing He pressure with all other parameters kept constant. This is attributed to the increase in thermal conductivity of the carrier gas. Rapid cooling of the clusters inhibits agglomeration of larger clusters resulting in a shrinking of the average particle size and a sharpening of the size distribution.
STX Series Circular Magnetron Sputtering Sources
STX Series Sources have targets from 5" to 12" Ø. These sources feature a special modular magnet array allowing for balanced, unbalanced, magnetic material, closed field, high utilization and high uniformity configurations. These units run with high power DC, Pulsed DC, HiPIMS, AC, and RF and feature direct or indirect water cooled backing plates. Both internal and external mounting is available. Tilt gimbals are offered with some sources for long throw, con-focal deposition at pressures as low as 0.2 mTorr.
STXL Series Rectangular Magnetron Sputtering Sources
STXL Sources are offered for targets from 75 mm x 300 mm to 150 mm x1 meter. These sources feature a special modular magnet array allowing for balanced, unbalanced, magnetic material, closed field, high utilization and high uniformity configurations. These units run with high power DC, Pulsed DC, HIPIMS, AC, and RF and feature direct or indirect water cooled backing plates. Internal and external mounting is offered. Adjustable gas injection frames optimize uniformity regardless of pump location dynamics.
CTX Series Cylindrical Magnetron Sputtering Sources
In larger 3D coating applications the CTX Series of cylindrical target magnetrons accomplishes the task in one easy step. With the sputtered flux arriving from the inner surface of the cylindrical target, this special source keeps the entire substrate surface "in the plasma" throughout the deposition for highly uniform film properties. Off-axis deposition and low damage films are easily realized. Custom built sources range from 6" to 24" ID. Targets can be machined from solid, rolled and bonded or plasma sprayed materials. Sources feature integral process gas distribution.
Axial Turret Sputtering Sources
The Axial Turret design locates multiple source heads, oriented axially, on the end of a rotatable support tube running through a hollow shaft, UHV, ferroflluid rotary vacuum feedthrough. The source heads are cooled and powered through the support tube and the assembly is indexed to aim the desired source at the substrate. A single port can be used to introduce multiple magnetrons into a deposition chamber. An interesting version shown has tilt gimbals on each source allowing further articulation of the source head. Turrets are available with up to 12 heads.
Radial Turret Sputtering Sources
The Radial Turret design locates multiple source heads, oriented radially, on the end of a rotatable support tube running through a hollow shaft, UHV, ferroflluid rotary vacuum feedthrough. The source heads are cooled and powered through the support tube and the assembly is indexed to aim the desired source at the substrate. A single port can be used to introduce multiple magnetrons into a deposition chamber. Turrets are available with up to 12 heads and integral RF/DC matchbox/switchbox modules.